Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications
Boston: Kluwer Academic Publishers, 1999.
Hardcover. Library stamps/marks/labels/pocket, otherwise light wear. Solid hardcover.; "Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications reviews the practical aspects of electrical and thermal modeling of packages and has no equivalent on the market, since it discusses analog (microwave) packaging as opposed..... More